主 题: 三维四面体填装与四面体砖
报告人: 孙家昶 研究员(中科院软件所)
时 间: 2010-09-24 14:00-15:00
地 点: 理科一号楼1114
In the past year (2009), a flurry of academic activity is suddenly
zooming in on an answer to a problem about the packing
of geometric solids known as tetrahedrons. Many scientists in different
fields, such as material science, chemical engineering,
physics, computer science, medical science and mathematics, have been
involved. \"Nature\" has published three articles on this
topic within four months (Aug.-Dec.) In this talk, we will introduce
some basic problems of tetrahedrons, such as tiling, packing
and covering, as well as so-called Tetrahedron-Brick.
